The Polish company XTPL is among a category of small startups sitting at the overlap between additive manufacturing (AM) and advanced packaging for the semiconductor industry. 3DPrint.com’s Vanesa Listek wrote...
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Perhaps this is a controversial viewpoint, but I am now thinking that recycling of 3D print waste is a lost cause. The post Why Recycling 3D Printer Scraps Will Never Work appeared on Fabbaloo.
Wool filament? Not exactly. The post “WoolyFil” Uses Natural Wool Pigments to Color PLA Filament appeared on Fabbaloo.
Technical University of Denmark has patented a resin 3D printing concept that moves the optics instead of exposing a whole layer at once. The post DTU Patent Targets Scanned Vat Photopolymerization appeared on Fabbaloo.
Shares of Xometry (Nasdaq: XMTR) surged on Thursday, May 7, after the company reported record first-quarter 2026 results and announced a major partnership with Siemens. The stock climbed as much...
In the summer of 2025, the US Indo-Pacific Command (INDOPACOM) opened a new advanced manufacturing facility at Schofield Barracks, the Hawaiian home of the US Army’s 25th Infantry Division. INDOPACOM...
A friend of mine, Ed Davis, once pointed out the level of strategic replication in additive. I wasn’t aware of it before and haven’t been able to unsee it since....