
Formnext Asia Shenzhen 2026 Spotlights AM’s Role in Cooling AI Hardware
Formnext Asia Shenzhen, the additive manufacturing trade show organized by Guangzhou Guangya Messe Frankfurt Co Ltd, will return to the Shenzhen World Exhibition & Convention Center from August 26 to 28, 2026, with a focus on how 3D printing is being used to produce liquid cooling components for AI infrastructure. As higher-density AI server chips…
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